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 HD74HC375
Quad. Bistable Latches
REJ03D0621-0200 (Previous ADE-205-500) Rev.2.00 Mar 30, 2006
Description
This latch is ideally suited for use as temporary storage for binary information between processing units and input/output or indicator units. Information present at a data (D) input is transferred to the Q output when the enable (G) is high and the Q output will follow the data input as long as the enable remains high. When the enable goes low, the information (that was present at the data input at the time the transition occurred) is retained at the Q output until the enable goes high.
Features
* High Speed Operation: tpd (Data to Q, Q) = 10 ns typ (CL = 50 pF) * High Output Current: Fanout of 10 LSTTL Loads * Wide Operating Voltage: VCC = 2 to 6 V * Low Input Current: 1 A max * Low Quiescent Supply Current: ICC (static) = 4 A max (Ta = 25C) * Ordering Information
Part Name HD74HC375P HD74HC375FPEL HD74HC375RPEL Package Type DILP-16 pin SOP-16 pin (JEITA) SOP-16 pin (JEDEC) Package Code (Previous Code) PRDP0016AE-B (DP-16FV) PRSP0016DH-B (FP-16DAV) Package Abbreviation P FP -- EL (2,000 pcs/reel) EL (2,500 pcs/reel) Taping Abbreviation (Quantity)
PRSP0016DG-A RP (FP-16DNV) Note: Please consult the sales office for the above package availability.
Function Table
Inputs D L H Note: G H H Q L H Outputs Q H L no change
X L no change 1. H; High level, L; Low level, X; Irrelevant, Z; High impedance
Rev.2.00 Mar 30, 2006 page 1 of 6
HD74HC375
Pin Arrangement
1D 1 1Q 2 1Q 3 Enable 1 to 2 4 2Q 5 2Q 6 2D 7 GND 8 (Top view) QC QD CQ DQ QD QC DQ CQ 16 VCC 15 4D 14 4Q 13 4Q 12 Enable 3 to 4
11 3Q 10 3Q 9 3D
Absolute Maximum Ratings
Item Supply voltage range Input / Output voltage Input / Output diode current Output current VCC, GND current Power dissipation Symbol VCC VIN, VOUT IIK, IOK IOUT ICC or IGND PT Ratings -0.5 to 7.0 -0.5 to VCC +0.5 20 25 50 500 Unit V V mA mA mA mW
Storage temperature Tstg -65 to +150 C Note: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of which may be realized at the same time.
Recommended Operating Conditions
Item Supply voltage Input / Output voltage Operating temperature Input rise / fall time Note:
*1
Symbol VCC VIN, VOUT Ta tr , tf
Ratings 2 to 6 0 to VCC -40 to 85 0 to 1000 0 to 500
Unit V V C ns
Conditions
VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V
0 to 400 1. This item guarantees maximum limit when one input switches. Waveform: Refer to test circuit of switching characteristics.
Rev.2.00 Mar 30, 2006 page 2 of 6
HD74HC375
Electrical Characteristics
Ta = 25C Item Input voltage Symbol VCC (V) VIH 2.0 4.5 6.0 VIL 2.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 VOL 2.0 4.5 6.0 4.5 Input current Quiescent supply current Iin ICC 6.0 6.0 6.0 Min 1.5 3.15 4.2 -- -- -- 1.9 4.4 5.9 4.18 5.68 -- -- -- -- -- -- -- Typ -- -- -- -- -- -- 2.0 4.5 6.0 -- -- 0.0 0.0 0.0 -- -- -- -- Max -- -- -- 0.5 1.35 1.8 -- -- -- -- -- 0.1 0.1 0.1 0.26 0.26 0.1 4.0 Ta = -40 to+85C Min 1.5 3.15 4.2 -- -- -- 1.9 4.4 5.9 4.13 5.63 -- -- -- -- -- -- -- Max -- -- -- 0.5 1.35 1.8 -- -- -- -- -- 0.1 0.1 0.1 0.33 0.33 1.0 40 V IOH = -4 mA IOH = -5.2 mA Vin = VIH or VIL IOL = 20 A V Unit V Test Conditions
Output voltage
VOH
V
Vin = VIH or VIL IOH = -20 A
IOH = 4 mA IOH = 5.2 mA A Vin = VCC or GND A Vin = VCC or GND, Iout = 0 A
Switching Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = 25C Item Propagation delay time Symbol VCC (V) tPLH tPHL tPLH tPHL Pulse width tw 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 Setup time tsu 2.0 4.5 6.0 2.0 4.5 6.0 Output rise/fall time Input capacitance tTLH tTHL Cin 2.0 4.5 6.0 -- Min -- -- -- -- -- -- 80 16 14 100 20 17 5 5 5 -- -- -- -- Typ -- 10 -- -- 11 -- -- 5 -- -- 2 -- -- -1 -- -- 5 -- 5 Max 145 29 25 160 32 27 -- -- -- -- -- -- -- -- -- 75 15 13 10 Ta = -40 to +85C Min -- -- -- -- -- -- 100 20 17 125 25 21 5 5 5 -- -- -- -- Max 180 36 31 200 40 34 -- -- -- -- -- -- -- -- -- 95 19 16 10 ns ns ns G to Q or Q Unit ns Test Conditions Data to Q or Q
ns
Hold time
th
ns
pF
Rev.2.00 Mar 30, 2006 page 3 of 6
HD74HC375
Test Circuit
VCC VCC Output
See Function Table
Input Pulse Generator Zout = 50 Input Pulse Generator Zout = 50
Enable G
Q CL = 50 pF Output
D
Q CL = 50 pF
Note : 1. CL includes probe and jig capacitance.
Waveforms
* Waveform - 1
tr Input D
10 % 90 % 50 % 90 % 50 % 50 % 10 %
tf VCC 0V tW t su th VCC
50 % 10 % 50 %
tW t su tr tf
90 % 50 % 50 %
th
Enable G
10 %
tW t PLH
tW t PHL
90 % 50 % 10 %
0V
Output Q
10 %
90 % 50 %
VOH VOL
t TLH t PHL Output Q
90 % 50 % 10 %
t THL t PLH
90 % 50 % 10 %
VOH VOL
t THL
t TLH
Notes: 1. Input waveform: PRR 1 MHz, Zo = 50 , tr 6 ns, tf 6 ns
Rev.2.00 Mar 30, 2006 page 4 of 6
HD74HC375
* Waveform - 2
tr 90 % 50 % 10 % t PLH 90 % Output Q 50 % 10 % t TLH 90 % 50 % 10 % t PHL 90 % 50 % 10 % t THL VOH VOL tf VCC 0V
Input D
t PHL 90 % Output Q
t PLH
90 % 50 % 10 % t THL 50 % 10 % t TLH
VOH VOL
Note: 1. Input waveform: PRR 1 MHz, Zo = 50 , tr 6 ns, tf 6 ns
Package Dimensions
JEITA Package Code P-DIP16-6.3x19.2-2.54 RENESAS Code PRDP0016AE-B Previous Code DP-16FV MASS[Typ.] 1.05g
D
16
9
1 0.89 b3
8
Z
A1
A
E
Reference Symbol
Dimension in Millimeters
Min
e
bp
e1
c
( Ni/Pd/Au plating )
e1 D E A A1 bp b3 c e Z L
Nom Max 7.62 19.2 20.32 6.3 7.4 5.06
L
0.51 0.40 0.48 0.56 1.30 0.19 0.25 0.31 0 15 2.29 2.54 2.79 1.12 2.54
Rev.2.00 Mar 30, 2006 page 5 of 6
HD74HC375
JEITA Package Code P-SOP16-5.5x10.06-1.27 RENESAS Code PRSP0016DH-B Previous Code FP-16DAV MASS[Typ.] 0.24g
*1
D F 9
16
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp
HE
E
Index mark
*2
Terminal cross section ( Ni/Pd/Au plating )
1 Z e
*3
8 bp x M L1
Reference Symbol
c
Dimension in Millimeters
A1
y
L
Detail F
D E A2 A1 A bp b1 c c1 HE e x y Z L L1
Min Nom Max 10.06 10.5 5.50 0.00 0.10 0.20 2.20 0.34 0.40 0.46 0.15 0.20 0.25 0 8 7.50 7.80 8.00 1.27 0.12 0.15 0.80 0.50 0.70 0.90 1.15
JEITA Package Code P-SOP16-3.95x9.9-1.27
RENESAS Code PRSP0016DG-A
Previous Code FP-16DNV
*1
D 9
A
MASS[Typ.] 0.15g
F
16
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp
E HE
Index mark
*2
Terminal cross section ( Ni/Pd/Au plating )
1 Z e
*3
c
8 bp x M L1
Reference Symbol
Dimension in Millimeters
A1
L
y
Detail F
D E A2 A1 A bp b1 c c1 HE e x y Z L L1
Min Nom Max 9.90 10.30 3.95 0.10 0.14 0.25 1.75 0.34 0.40 0.46 0.15 0.20 0.25 0 8 5.80 6.10 6.20 1.27 0.25 0.15 0.635 0.40 0.60 1.27 1.08
Rev.2.00 Mar 30, 2006 page 6 of 6
A
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
http://www.renesas.com
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(c) 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .6.0


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